Temperature dependency of the strain distribution induced by TSVs in silicon: A comparative study between micro-Laue and monochromatic nano-diffraction

Autor: Vianne, B., Escoubas, S., Krauss, C., Richard, M.-I., Labat, S., Chahine, G., Micha, J.-S., Schülli, T., Fiori, V., Farcy, A., Thomas, O.
Zdroj: In Microelectronic Engineering 20 April 2016 156:59-64
Databáze: ScienceDirect