Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy
| Autor: | Bayat, Parisa, Vogel, Dietmar, Rodriguez, Raul D., Sheremet, Evgeniya, Zahn, Dietrich R.T., Rzepka, Sven, Michel, Bernd |
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| Zdroj: | In Microelectronic Engineering 2 April 2015 137:101-104 |
| Databáze: | ScienceDirect |
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