28 nm pitch of line/space pattern transfer into silicon substrates with chemo-epitaxy Directed Self-Assembly (DSA) process flow
| Autor: | Chan, Boon Teik, Tahara, Shigeru, Parnell, Doni, Rincon Delgadillo, Paulina A., Gronheid, Roel, de Marneffe, Jean-François, Xu, Kaidong, Nishimura, Eiichi, Boullart, Werner |
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| Zdroj: | In Microelectronic Engineering 1 July 2014 123:180-186 |
| Databáze: | ScienceDirect |
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