Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods
| Autor: | Zhu, Wenbo, Wu, Fengshun, Wang, Baihui, Hou, Eric, Wang, Paul, Liu, Changqing, Xia, Weisheng |
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| Zdroj: | In Microelectronic Engineering 5 October 2014 128:24-30 |
| Databáze: | ScienceDirect |
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