Thermal management of electronic devices by composite materials integrated in silicon
| Autor: | Ollier, Emmanuel, Soupremanien, U., Remondière, V., Dijon, J., Le Poche, H., Seiler, A.L., Lefevre, F., Lips, S., Kinkelin, C., Rolland, N., Rolland, P.A., Zegaoui, M., Lhostis, S., Ancey, P., Descouts, B., Kaplan, Y. |
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| Zdroj: | In Microelectronic Engineering 5 September 2014 127:28-33 |
| Databáze: | ScienceDirect |
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