Highly reliable molecular-pore-stacking (MPS)/Cu interconnects featuring best combination of post-etching treatment and resputtering processes
| Autor: | Oshida, Daisuke, Kume, Ippei, Katsuyama, Hirokazu, Ueki, Makoto, Iguchi, Manabu, Yokogawa, Shinji, Inoue, Naoya, Oda, Noriaki, Sakurai, Michio |
|---|---|
| Zdroj: | In Microelectronic Engineering 25 April 2014 118:72-78 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect