Simulation and measurement of the capacitance benefit of air gap interconnects for advanced technology nodes
| Autor: | Kumaresan, V., Wilson, C.J., Verdonck, P., Van Besien, E., Lazzarino, F., Truffert, V., Bömmels, J., Tokei, Zs., Wong, T.K.S. |
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| Zdroj: | In Microelectronic Engineering 25 May 2014 120:90-94 |
| Databáze: | ScienceDirect |
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