Scalability of RuTiN barriers deposited by plasma-enhanced atomic layer deposition for advanced interconnects
| Autor: | Swerts, Johan, Siew, Yong-Kong, Van Besien, Els, Barbarin, Yohan, Opsomer, Karl, Bömmels, Jürgen, Tőkei, Zsolt, Van Elshocht, Sven |
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| Zdroj: | In Microelectronic Engineering 25 May 2014 120:235-239 |
| Databáze: | ScienceDirect |
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