Recycling a slurry for reuse in chemical mechanical planarization of tungsten wafer: Effect of chemical adjustments and comparison between static and dynamic experiments
| Autor: | Testa, F., Coetsier, C., Carretier, E., Ennahali, M., Laborie, B., Moulin, P. |
|---|---|
| Zdroj: | In Microelectronic Engineering January 2014 113:114-122 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect