Copper pillar interconnect capability for mmwave applications in 3D integration technology
| Autor: | Joblot, S., Bar, P., Sibuet, H., Ferrandon, C., Reig, B., Jan, S., Arnaud, C., Lamy, Y., Coudrain, P., Coffy, R., Boillon, O., Carpentier, J.F. |
|---|---|
| Zdroj: | In Microelectronic Engineering July 2013 107:72-79 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect