Copper electrodeposition into macroporous silicon arrays for through silicon via applications

Autor:	Defforge, T., Coudron, L., Ménard, O., Grimal, V., Gautier, G., Tran-Van, F.
Zdroj:	In Microelectronic Engineering June 2013 106:160-163
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect