Investigation of CH4, NH3, H2 and He plasma treatment on porous low-k films and its effects on resisting moisture absorption and ions penetration
| Autor: | Lu, Hai-Sheng, Gottfried, Knut, Ahner, Nicole, Schulz, Stefan, Qu, Xin-Ping |
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| Zdroj: | In Microelectronic Engineering June 2013 106:85-90 |
| Databáze: | ScienceDirect |
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