New method to evaluate materials outgassing used in MEMS thin film packaging technology

Autor: Savornin, B., Baillin, X., Blanquet, E., Nuta, I., Saint Patrice, D., Nicolas, P., Charvet, P.L., Pornin, J.L.
Zdroj: In Microelectronic Engineering July 2013 107:97-100
Databáze: ScienceDirect