Use of side chain thiophene containing copolymer as a non-ionic gel-dielectric material for sandwich OFET assembly

Autor: Şengez, Büşra, Doğruyol, Zekeriya, San, Sait E., Kösemen, Arif, Yılmaz, Faruk, Okutan, Mustafa, Yerli, Yusuf, Demir, Ahmet, Başaran, Engin
Zdroj: In Microelectronic Engineering March 2013 103:111-117
Databáze: ScienceDirect