Finite element modeling of temporary bonding systems for flexible microelectronics fabrication
| Autor: | Haq, Jesmin a, ⁎, Vogt, Bryan D. b, Raupp, Gregory B. c, Loy, Doug a |
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| Zdroj: | In Microelectronic Engineering June 2012 94:18-25 |
| Databáze: | ScienceDirect |
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