Thermal design of hot plate for 300-mm wafer heating in post-exposure bake
| Autor: | Lee, Jinho, Kwon, Hyun Goo, Shin, Sangwoo, Han, Sangjo, Ha, Jungik, Yoo, Hosun, Cho, Hyung Hee |
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| Zdroj: | In Microelectronic Engineering 2011 88(11):3195-3198 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect