Ultra-dense silicon nanowires: A technology, transport and interfaces challenges insight (invited)

Autor: Ernst, T., Barraud, S., Tachi, K., Vizioz, C., Magis, T., Brianceau, P., Hubert, A., Vulliet, N., Hartmann, J.-M., Cassé, M.
Zdroj: In Microelectronic Engineering 2011 88(7):1198-1202
Databáze: ScienceDirect