3D monolithic integration: Technological challenges and electrical results

Autor: Vinet, M. a, ⁎, Batude, P. a, Tabone, C. a, Previtali, B. a, LeRoyer, C. a, Pouydebasque, A. a, Clavelier, L. a, Valentian, A. a, Thomas, O. a, Michaud, S. a, Sanchez, L. a, Baud, L. a, Roman, A. a, Carron, V. a, Nemouchi, F. a, Mazzocchi, V. a, Grampeix, H. a, Amara, A. b, Deleonibus, S. a, Faynot, O. a
Zdroj: In Microelectronic Engineering 2011 88(4):331-335
Databáze: ScienceDirect