Wafer-scale 3D integration of InGaAs photodiode arrays with Si readout circuits by oxide bonding and through-oxide vias
| Autor: | Chen, C.L., Yost, D.-R., Knecht, J.M., Wey, J., Chapman, D.C., Oakley, D.C., Soares, A.M., Mahoney, L.J., Donnelly, J.P., Chen, C.K., Suntharalingam, V., Berger, R., Hu, W., Wheeler, B.D., Keast, C.L., Shaver, D.C. |
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| Zdroj: | In Microelectronic Engineering 2011 88(1):131-134 |
| Databáze: | ScienceDirect |
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