Barrier and seed repair performance of thin RuTa films for Cu interconnects
| Autor: | Volders, H., Carbonell, L., Heylen, N., Kellens, K., Zhao, C., Marrant, K., Faelens, G., Conard, T., Parmentier, B., Steenbergen, J., Peer, M. Van de, Wilson, C.J., Sleeckx, E., Beyer, G.P., Tőkei, Zs., Gravey, V., Shah, K., Cockburn, A. |
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| Zdroj: | In Microelectronic Engineering 2011 88(5):690-693 |
| Databáze: | ScienceDirect |
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