Combined use of three-dimensional X-ray diffraction imaging and micro-Raman spectroscopy for the non-destructive evaluation of plasma arc induced damage on silicon wafers
| Autor: | Stopford, J., Allen, D., Aldrian, O., Morshed, M., Wittge, J., Danilewsky, A.N., McNally, P.J. |
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| Zdroj: | In Microelectronic Engineering 2011 88(1):64-71 |
| Databáze: | ScienceDirect |
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