Characterization and modeling of RF substrate coupling effects in 3D integrated circuit stacking
| Autor: | Eid, E., Lacrevaz, T., Bermond, C., Capraro, S., Roullard, J., Fléchet, B., Cadix, L., Farcy, A., Ancey, P., Calmon, F., Valorge, O., Leduc, P. |
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| Zdroj: | In Microelectronic Engineering 2011 88(5):729-733 |
| Databáze: | ScienceDirect |
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