Post Si(C)N hillock nucleation and growth in IC copper lines controlled by diffusional creep
Autor: | Timma, A., Caubet, P., Chenevier, B., Thomas, O., Kaouache, B., Dumas, L., Normandon, P., Giraudin, J.C. |
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Zdroj: | In Microelectronic Engineering 2010 87(3):361-364 |
Databáze: | ScienceDirect |
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