Analysis of nickel cylindrical bump insertion into aluminium thin film for flip chip applications
| Autor: | Diop, M.D., Mandrillon, V., Boutry, H., Inal, K., Fortunier, R. |
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| Zdroj: | In Microelectronic Engineering 2010 87(3):522-526 |
| Databáze: | ScienceDirect |
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