Thinned wafer multi-stack 3DI technology
| Autor: | Ohba, Takayuki, Maeda, Nobuhide, Kitada, Hideki, Fujimoto, Koji, Suzuki, Kousuke, Nakamura, Tomoji, Kawai, Akihito, Arai, Kazuhisa |
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| Zdroj: | In Microelectronic Engineering 2010 87(3):485-490 |
| Databáze: | ScienceDirect |
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