Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn–Zn binary solder and Au/Ni/Cu bond pads
| Autor: | Das, S.K., Sharif, A., Chan, Y.C., Wong, N.B., Yung, W.K.C. |
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| Zdroj: | In Microelectronic Engineering 2009 86(10):2086-2093 |
| Databáze: | ScienceDirect |
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