Texture and strain in narrow copper damascene interconnect lines: An X-ray diffraction analysis
| Autor: | Kaouache, B., Labat, S., Thomas, O., Maitrejean, S., Carreau, V. |
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| Zdroj: | In Microelectronic Engineering 2008 85(10):2175-2178 |
| Databáze: | ScienceDirect |
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