Improvement of thermal stability of Ni silicide on N +–Si by direct deposition of group III element (Al, B) thin film at Ni/Si interface

Autor: Tsutsui, Kazuo, Shiozawa, Takashi, Nagahiro, Koji, Ohishi, Yoshihisa, Kakushima, Kuniyuki, Ahmet, Parhat, Urushihara, Nobuyuki, Suzuki, Mineharu, Iwai, Hiroshi
Zdroj: In Microelectronic Engineering 2008 85(10):2000-2004
Databáze: ScienceDirect