Cracking energy estimation of ultra low- k package using novel prediction approach combined with global–local modeling technique
| Autor: | Lee, Chang-Chun, Chou, Tsung-Lin, Chiu, Chien-Chia, Hsia, Chin-Chiu, Chiang, Kuo-Ning |
|---|---|
| Zdroj: | In Microelectronic Engineering 2008 85(10):2079-2084 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect