Morphology evolution in TiN/Al–0.5Cu/Ti interconnection during chamber long stay and post-deposition annealing correlated to defect formation in metallization processing
| Autor: | Li, Ming-Yen, Su, Mei-Yun, Chang, Te-Fu, Tsai, Bin-Siang, Tsai, Wen-Li, Wu, Hsiao-Che, Chuang, Poyo, Yang, Tsung-Hsun, Yen, Haw |
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| Zdroj: | In Microelectronic Engineering 2008 85(7):1502-1510 |
| Databáze: | ScienceDirect |
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