Electroless deposition and electrical resistivity of sub-100 nm Cu films on SAMs: State of the art
Autor: | Glickman, E., Inberg, A., Fishelson, N., Shaham-Diamand, Y. |
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Zdroj: | In Microelectronic Engineering 2007 84(11):2466-2470 |
Databáze: | ScienceDirect |
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