Integration and characterization of gas cluster processing for copper interconnects electromigration improvement
| Autor: | Gras, R., Gosset, L.G., Petitprez, E., Girault, V., Hopstaken, M., Jullian, S., Imbert, G., Le Friec, Y., Bienacel, J., Guillan, J., Chevolleau, T., Sherman, S., Tabat, M., Hautala, J., Torres, J. |
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| Zdroj: | In Microelectronic Engineering 2007 84(11):2675-2680 |
| Databáze: | ScienceDirect |
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