Study of factors affecting the hardness of ball bonds in copper wire bonding

Autor: Zhong, Z.W., Ho, H.M., Tan, Y.C., Tan, W.C., Goh, H.M., Toh, B.H., Tan, J.
Zdroj: In Microelectronic Engineering 2007 84(2):368-374
Databáze: ScienceDirect
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