Crack initiation in Cu-interconnect structures
| Autor: | Brillet-Rouxel, H., Arfan, E., Leguillon, D., Dupeux, M., Braccini, M., Orain, S. |
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| Zdroj: | In Microelectronic Engineering 2006 83(11):2297-2302 |
| Databáze: | ScienceDirect |
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| Autor: | Brillet-Rouxel, H., Arfan, E., Leguillon, D., Dupeux, M., Braccini, M., Orain, S. |
|---|---|
| Zdroj: | In Microelectronic Engineering 2006 83(11):2297-2302 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect