Stress evolution during intermittent deposition of metallic thin films

Autor:	Gladyszewski, G., Chocyk, D., Proszynski, A., Pienkos, T.
Zdroj:	In Microelectronic Engineering 2006 83(11):2351-2354
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect