Integration of a high density Ta 2O 5 MIM capacitor following 3D damascene architecture compatible with copper interconnects
| Autor: | Thomas, M., Farcy, A., Gaillard, N., Perrot, C., Gros-Jean, M., Matko, I., Cordeau, M., Saikaly, W., Proust, M., Caubet, P., Deloffre, E., Crémer, S., Bruyère, S., Chenevier, B., Torres, J. |
|---|---|
| Zdroj: | In Microelectronic Engineering 2006 83(11):2163-2168 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect