Microcontacts with sub-30 μm pitch for 3D chip-on-chip integration
| Autor: | Huebner, H., Penka, S., Barchmann, B., Eigner, M., Gruber, W., Nobis, M., Janka, S., Kristen, G., Schneegans, M. |
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| Zdroj: | In Microelectronic Engineering 2006 83(11):2155-2162 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect