Impact of introducing CuSiN self-aligned barriers in advanced copper interconnects
| Autor: | Chhun, S., Gosset, L.G., Casanova, N., Ney, D., Delille, D., Trouiller, C., Hopstaken, M., Chausse, P., Grégoire, M., Gautier, B., Dupuy, J.-C., Torres, J. |
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| Zdroj: | In Microelectronic Engineering 2005 82(3):587-593 |
| Databáze: | ScienceDirect |
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