High manufacturability Cu multilevel interconnects featuring hybrid-NCS structure
| Autor: | Sugiura, I., Misawa, N., Otsuka, S., Nishikawa, N., Iba, Y., Sugimoto, F., Setta, Y., Sakai, H., Koura, Y., Nakano, K., Karasawa, T., Ohkura, Y., Kouno, T., Watatani, H., Nakata, Y., Mizushima, Y., Suzuki, T., Kitada, H., Shimizu, N., Nakai, S., Nakaishi, M., Fukuyama, S., Nakamura, T., Yano, E., Miyajima, M., Watanabe, K. |
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| Zdroj: | In Microelectronic Engineering 2005 82(3):380-386 |
| Databáze: | ScienceDirect |
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