Impact of patterning and ashing on electrical properties and reliability of interconnects in a porous SiOCH ultra low- k dielectric material
| Autor: | Aimadeddine, M., Arnal, V., Farcy, A., Guedj, C., Chevolleau, T., Possémé, N., David, T., Assous, M., Louveau, O., Volpi, F., Torres, J. |
|---|---|
| Zdroj: | In Microelectronic Engineering 2005 82(3):341-347 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect