Origin, control and elimination of undercut in silicon deep plasma etching in the cryogenic process
Autor: | Boufnichel, M., Lefaucheux, P., Aachboun, S., Dussart, R. *, Ranson, P. |
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Zdroj: | In Microelectronic Engineering 2005 77(3):327-336 |
Databáze: | ScienceDirect |
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