UV curing of resists for warm embossing

Autor: Wissen, M., Schulz, H., Bogdanski, N., Scheer, H.-C., Hirai, Y., Kikuta, H., Ahrens, G., Reuther, F., Pfeiffer, K.
Zdroj: In Microelectronic Engineering 2004 73:184-189
Databáze: ScienceDirect