Characterization of barrier/seed layer stacks of Cu interconnects by electron tomographic three-dimensional object reconstruction
| Autor: | Stegmann, Heiko ∗, Engelmann, Hans-Jürgen, Zschech, Ehrenfried |
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| Zdroj: | In Microelectronic Engineering 2003 65(1):171-183 |
| Databáze: | ScienceDirect |
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