Electrical assessment of copper damascene interconnects down to sub-50 nm feature sizes
| Autor: | Steinlesberger, G. ∗, Engelhardt, M., Schindler, G., Steinhögl, W., von Glasow, A., Mosig, K., Bertagnolli, E. |
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| Zdroj: | In Microelectronic Engineering 2002 64(1):409-416 |
| Databáze: | ScienceDirect |
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