Thermal aware placement in 3D ICs using quadratic uniformity modeling approach
| Autor: | Yan, Haixia, Zhou, Qiang, Hong, Xianlong |
|---|---|
| Zdroj: | In Integration, the VLSI Journal 2009 42(2):175-180 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Yan, Haixia, Zhou, Qiang, Hong, Xianlong |
|---|---|
| Zdroj: | In Integration, the VLSI Journal 2009 42(2):175-180 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
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