Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array
Autor: | Jiang, Han, Robertson, Stuart, Liang, Shuibao, Zhou, Zhaoxia, Zhao, Liguo, Liu, Changqing |
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Zdroj: | In Materials Letters 15 January 2022 307 |
Databáze: | ScienceDirect |
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