Rapid formation of intermetallic joint using Cu-Sn nanocomposite interlayer based on patterned copper nanowire array

Autor: Jiang, Han, Robertson, Stuart, Liang, Shuibao, Zhou, Zhaoxia, Zhao, Liguo, Liu, Changqing
Zdroj: In Materials Letters 15 January 2022 307
Databáze: ScienceDirect