Enhancing the life cycle behaviour of Cu-Al-Ni shape memory alloy bimorph by Mn addition

Autor: Akash, K., Mani Prabu, S.S., Gustmann, Tobias, Jayachandran, S., Pauly, Simon, Palani, I.A.
Zdroj: In Materials Letters 1 September 2018 226:55-58
Databáze: ScienceDirect