Enhancing the life cycle behaviour of Cu-Al-Ni shape memory alloy bimorph by Mn addition
Autor: | Akash, K., Mani Prabu, S.S., Gustmann, Tobias, Jayachandran, S., Pauly, Simon, Palani, I.A. |
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Zdroj: | In Materials Letters 1 September 2018 226:55-58 |
Databáze: | ScienceDirect |
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