Local distribution of residual stress of Cu in LSI interconnect

Autor: Sato, Hisashi, Shishido, Nobuyuki, Kamiya, Shoji, Koiwa, Kozo, Omiya, Masaki, Nishida, Masahiro, Suzuki, Takashi, Nakamura, Tomoji, Nokuo, Takeshi
Zdroj: In Materials Letters 1 December 2014 136:362-365
Databáze: ScienceDirect