Stress–strain characteristics of tin-based solder alloys at medium strain rate
| Autor: | Wong, E.H., Selvanayagam, C.S., Seah, S.K.W., van Driel, W.D., Caers, J.F.J.M., Zhao, X.J., Owens, N., Tan, L.C., Frear, D.R., Leoni, M., Lai, Y.-S., Yeh, C.-L. |
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| Zdroj: | In Materials Letters 2008 62(17):3031-3034 |
| Databáze: | ScienceDirect |
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